News -
August 28, 2026
Dynalene Achieves Open Compute Project (OCP) Accepted™ Status for Advanced Data Center Coolant Fluid
WHITEHALL, PA, UNITED STATES, August 12, 2026 — Dynalene, a leading U.S.-based specialty manufacturer of high-performance heat transfer fluids, is proud to announce that it has officially been recognized under the Open Compute Project (OCP) Accepted™ program for its Dynalene PG-D25 coolant, designed specifically for direct-to-chip cooling. This milestone reinforces the company’s commitment to advancing sustainable and efficient liquid cooling technologies for the data center and high-performance computing industries.
The Open Compute Project (OCP) is an organization that facilitates the sharing of data center product designs and industry best practices among companies. Founded in 2011, OCP has significantly influenced the design and operation of large-scale computing facilities worldwide. As of 2026, over 650 companies across the world are members of OCP.
The OCP Product Recognition Program (https://www.opencompute.org/sp/product-recognition-program) is designed to formally recognize products that align with OCP-approved contributions. Earning the OCP Accepted™ designation indicates that a product complies with an approved OCP specification and clearly demonstrates the core OCP tenets of efficiency, openness, impact, scale, and sustainability.
"At Dynalene, our mission has always been to help industries operate safely, sustainably, and efficiently. Earning the OCP Accepted™ recognition is a testament to our deep commitment to materials science and thermal innovation. We are extremely proud to actively collaborate with the Open Compute Project global community to deliver scalable, open-source liquid cooling solutions that address the unprecedented thermal demands of next-generation AI data centers."
— Satish Mohapatra, PhD, President and CEO of Dynalene
Dynalene utilizes high-quality USP-grade propylene glycol to formulate PG-D25 coolant, featuring a proprietary additive package designed specifically for direct-to-chip cooling. It delivers exceptional multi-metal corrosion protection, particularly for the copper cold plates and heat exchangers utilized in most coolant distribution units (CDUs), and provides a robust defense against algae and bacteria growth. Dynalene PG-D25 coolant passes ASTM tests for heat transfer coolants (D8040), thermal stability (D7437), and coolant foaming (D1881). By implementing Dynalene’s advanced liquid cooling solutions, data centers can optimize their Power Usage Effectiveness (PUE), and increase overall rack density. Demonstrating high-volume capabilities, Dynalene has successfully delivered multiple large-scale global orders of up to a million gallons per project for various applications, including data centers.
For more information on Dynalene’s complete portfolio of data center cooling solutions and participation in the OCP community, visit www.dynalene.com.